Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package

ABSTRACT

A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate having a first surface and a second surface arranged opposite to the first surface; a stress-sensitive sensor disposed at the first surface of the substrate, where the stress-sensitive sensor is sensitive to mechanical stress; a stress-decoupling trench that has a vertical extension that extends from the first surface into the substrate, where the stress-decoupling trench vertically extends partially into the substrate towards the second surface although not completely to the second surface; and a plurality of particle filter trenches that vertically extend from the second surface into the substrate, wherein each of the plurality of particle filter trenches have a longitudinal extension that extends orthogonal to the vertical extension of the stress-decoupling trench.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.16/387,918 filed Apr. 18, 2019, which is incorporated by reference as iffully set forth.

FIELD

The present disclosure relates generally to semiconductor devices and amethod of manufacturing the same, and, more particularly,stress-sensitive sensors with a stress relief mechanism.

BACKGROUND

Microelectromechanical systems (MEMS) are microscopic devices,particularly those with moving parts. MEMS became practical once theycould be fabricated using modified semiconductor device fabricationtechnologies, normally used to make electronics. Thus, a MEMS may bebuilt into a substrate as a component of an integrated circuit, that isdiced into a semiconductor chip that is subsequently mounted in apackage.

Mechanical stress, including stress generated by a chip package, andexternal mechanical influences introduced to a package may inadvertentlybe transferred through the package to an integrated MEMS element, suchas sensor, and, more particularly, to a pressure sensor. Thistransferred mechanical stress may affect the operation of the MEMSelement or induce a shift (e.g., an offset) in a sensor signal that maylead to incorrect measurements.

For example, semiconductor pressure sensors have a pressure sensitiveelement arranged to measure an absolute pressure or a relative pressure(e.g. the difference between two pressures). A problem with manypressure sensors is that the sensor measures (or outputs, or gives) asignal, even in the absence of a pressure (or pressure difference) to bemeasured. This offset may be the result of mechanical stress and/ordeformation of the housing (e.g., the packaging) of the sensor. Thehousing-stress/deformation will typically also cause a stress-componentat the sensor surface where the sensitive elements (e.g.,piezo-resistors) are located, and thereby cause an offset error, alinearity error, or even a hysteresis error to the output signal.

Therefore, an improved device capable of decoupling mechanical stressfrom an integrated MEMS element may be desirable.

SUMMARY

Embodiments provide semiconductor devices and a method of manufacturingthe same, and, more particularly, stress-sensitive sensors with a stressrelief mechanism.

One or more embodiments provide a semiconductor device that includes asubstrate having a first surface and a second surface arranged oppositeto the first surface; a first stress-sensitive sensor disposed at thefirst surface of the substrate, wherein the first stress-sensitivesensor is sensitive to mechanical stress; a first stress-decouplingtrench that has a vertical extension that extends from the first surfaceinto the substrate, wherein the first stress-decoupling trenchvertically extends partially into the substrate towards the secondsurface although not completely to the second surface; and a pluralityof particle filter trenches that vertically extend from the secondsurface into the substrate, wherein each of the plurality of particlefilter trenches have a longitudinal extension that extends orthogonal tothe vertical extension of the first stress-decoupling trench, andwherein each of the plurality of particle filter trenches is separatedfrom an adjacent particle filter trench of the plurality of particlefilter trenches by a backside portion of the substrate that extends fromthe second surface to a bottom of the first stress-decoupling trench.

One or more further embodiments provide a method of manufacturing asemiconductor device. The method includes performing a frontendfabrication of a semiconductor substrate having a first surface and asecond surface arranged opposite to the first surface, the frontendfabrication including integrating a first stress-sensitive sensordisposed at the first surface of the substrate, and forming a firststress-decoupling trench in the substrate, wherein the firststress-decoupling trench has a vertical extension that extends from thefirst surface into the substrate, wherein the first stress-decouplingtrench vertically extends partially into the substrate towards thesecond surface although not completely to the second surface; andforming a plurality of particle filter trenches at the second surface ofthe substrate, wherein the plurality of particle filter trenchesvertically extend from the second surface into the substrate, whereineach of the plurality of particle filter trenches have a longitudinalextension that extends orthogonal to the vertical extension of the firststress-decoupling trench, and wherein each of the plurality of particlefilter trenches is separated from an adjacent particle filter trench ofthe plurality of particle filter trenches by a backside portion of thesubstrate that extends from the second surface to a bottom of the firststress-decoupling trench.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments are described herein making reference to the appendeddrawings.

FIG. 1A shows a vertical cross-sectional diagram of a chip according toone or more embodiments, taken along line A-A in FIGS. 1B and 1C;

FIGS. 1B and 1C illustrate a top-view and a bottom-view of the chipshown in FIG. 1A, respectively, according to one or more embodiments;

FIG. 1D shows a vertical cross-sectional diagram of a chip according toone or more embodiments, taken along line B-B in FIGS. 1B and 1C;

FIG. 2 shows a cross-sectional diagram of a chip according to one ormore embodiments;

FIG. 3A shows a top-view diagram of a chip according to one or moreembodiments;

FIG. 3B shows a cross-sectional diagram of the chip taken along line C-Cshown in FIG. 3A;

FIGS. 4A-4D show cross-sectional views that illustrate a manufacturingprocess of integrated stress-sensitive sensors according to one or moreembodiments;

FIGS. 5A-5G show cross-sectional views that illustrate a manufacturingprocess of integrated stress-sensitive sensors according to one or moreembodiments that includes wafer level ball (WLB) grid array integration;and

FIGS. 6A and 6B show cross-sectional views that illustrate analternative manufacturing process of integrated stress-sensitive sensorsaccording to one or more embodiments that includes WLB grid arrayintegration.

DETAILED DESCRIPTION

In the following, various embodiments will be described in detailreferring to the attached drawings, where like reference numerals referto like elements throughout. It should be noted that these embodimentsserve illustrative purposes only and are not to be construed aslimiting. For example, while embodiments may be described as comprisinga plurality of features or elements, this is not to be construed asindicating that all these features or elements are needed forimplementing embodiments. Instead, in other embodiments, some of thefeatures or elements may be omitted, or may be replaced by alternativefeatures or elements. Additionally, further features or elements inaddition to the ones explicitly shown and described may be provided, forexample conventional components of sensor devices.

Features from different embodiments may be combined to form furtherembodiments, unless specifically noted otherwise. Variations ormodifications described with respect to one of the embodiments may alsobe applicable to other embodiments. In some instances, well-knownstructures and devices are shown in block diagram form rather than indetail in order to avoid obscuring the embodiments.

Connections or couplings between elements shown in the drawings ordescribed herein may be wire-based connections or wireless connectionsunless noted otherwise. Furthermore, such connections or couplings maybe direct connections or couplings without additional interveningelements or indirect connections or couplings with one or moreadditional intervening elements, as long as the general purpose of theconnection or coupling, for example to transmit a certain kind of signalor to transmit a certain kind of information, is essentially maintained.

One or more embodiments relate to stress-sensitive sensors integrated ina semiconductor chip and subsequently mounted to a package.Stress-sensitive sensors include microelectromechanical systems (MEMS)stress sensors, including MEMS pressure sensors. The MEMS may bereferred to as a MEMS element or MEMS device, and may include, forexample, capacitive MEMS sensor devices or piezo-resistive MEMS sensordevices.

The package may be adapted to enable a MEMS pressure sensor to detectand/or measure a force imposed thereon. For example, the MEMS pressuresensor may operate as a transducer that generates an electrical signalas a function of the pressure imposed, and the package may have anopening formed in proximity to the MEMS pressure sensor that allows amedium to interact with the MEMS pressure sensor. The medium may be anypressure measurable or pressure inducing entity.

In general, a sensor, as used herein, may refer to a component whichconverts a physical quantity to be measured to an electric signal, forexample a current signal or a voltage signal. The physical quantity mayfor example comprise a magnetic field, an electric field, a pressure, aforce, a temperature, a current, or a voltage, but is not limitedthereto. A sensor device, as described herein, may be a voltage sensor,a current sensor, a temperature sensor, a magnetic sensor, and the like.The physical quantity may, for example, be pressure as an expression offorce imposed on a sensitive area or region of the sensor Thus, thesensor may directly measure and/or detect stress, and generate a sensorsignal based on the detected stress.

Alternatively, the sensor may generate a sensor signal based on someother physical quantity (e.g., a Hall sensor sensitive to a magneticfield). In this case. mechanical stress transferred to the sensor mayadversely affect the sensor signal (e.g., based on a purely parasiticeffect). Thus, the sensor could be said to have indirectly measuredand/or detected stress.

Thus, a stress-sensitive sensor is any sensor that is sensitive tomechanical stress, either directly or indirectly, in a way that impactsthe sensor signal. Stress sensitive sensors include both MEMS sensorsand non-MEMS sensors. While some examples are directed to MEMS sensorsfor the stress-sensitive sensor, it will be appreciated that MEMSsensors and non-MEMS sensors may be regarded as interchangeable.

Debris, such as foreign particles, may negatively impact the performanceof any sensor. Thus, it may be desirable to prevent debris from reachingthe surface of the sensor, and, specifically, from reaching thesensitive area or region of the sensor and prevent particles fromreaching (and blocking) stress decoupling trenches.

A manufacturing process for semiconductor chip fabrication may includetwo sequential sub-processes commonly referred to as front-end andback-end production. The back-end production may further include twosequential sub-processes commonly referred to as pre-assembly andassembly.

Front-end production refers primarily to wafer fabrication. A wafer, asused herein, may also be referred to as a substrate. The front-endproduction may start with a clean disc-shaped silicon wafer that willultimately become many silicon chips. First, a photomask that definesthe circuit patterns for circuit elements (e.g., transistors) andinterconnect layers may be created. This mask may then be laid on theclean silicon wafer and is used to map the circuit design. Transistorsand other circuit elements may then be formed on the wafer throughphotolithography. Photolithography involves a series of steps in which aphotosensitive material is deposited on the wafer and exposed to lightthrough a patterned mask; unwanted exposed material is then etched away,leaving only the desired circuit pattern on the wafer. By stacking thevarious patterns, individual elements of the semiconductor chip may bedefined. A stress-sensitive sensor, which may be a MEMS device or a MEMSelement, may also be incorporated onto and/or into the surface of thewafer and connected to one or more circuit elements. During the finalphase of the front-end production process, each individual chip on thewafer is electrically tested to identify properly functioning chips forassembly.

Back-end production refers to the assembly and test of individualsemiconductor devices or chips. The assembly process is intended toprotect the chip, facilitate its integration into electronic systems,limit electrical interference and enable the dissipation of heat fromthe device. Once the front-end production process is complete, the waferis sawed or diced into individual semiconductor chips. This dicing ofthe wafer into individual semiconductor chips is referred to aspre-assembly.

In an assembly phase of the back-end production, the semiconductor chipsare incorporated into a package. For example, these semiconductor chipsmay be individually attached by means of an alloy or an adhesive to alead frame, a metallic device used to connect the semiconductor to acircuit board. Leads on the lead frame may then be connected by aluminumor gold wires to the input/output terminals on the semiconductor chipthrough the use of automated machines known as wire bonders. Eachsemiconductor device may then be at least partially encapsulated in aplastic molding compound or a ceramic case, forming the package.

Thus, a MEMS element or other stress-sensitive sensor may be built intoa substrate as a component of an integrated circuit, the substrate thenbeing diced into semiconductor chips that are each subsequently mountedin a package.

It will be appreciated that while the pre-assembly (i.e., dicing)process may be described as part of the back-end production flow, thechips may be partially singulated during final phase of the front-endproduction. Thus, in some instances, pre-assembly may begin or may beperformed during the front-end production.

According to one or more embodiments, mechanical stress-decoupling isprovided to a stress-sensitive sensor as a stress relief mechanism. Astress-decoupling feature such as one or more trenches (i.e., one ormore stress-decoupling trenches) may be provided. In additional, eachstress-decoupling trench may be filled with a gel (e.g., a silicone gel)and the gel may additionally be deposited over the stress-sensitivesensor at the wafer level (i.e., during the front-end productionprocess), or during or subsequent to the pre-assembly process, includingprior to or subsequent to packaging. The protective material may bedeposited on an exposed surface of the stress-sensitive sensor such thatan entire exposed surface of the stress-sensitive sensor is covered bythe protective material.

The exposed surface of the stress-sensitive sensor may include or may bereferred to as a sensitive area that enables the stress-sensitive sensorto measure a physical quantity. For example, the stress-sensitive sensormay be a MEMS pressure sensor that is configured to detect or measure achange in pressure in response to a change of force imposed on theexposed surface. The protective material is configured such that, whenthe stress-sensitive sensor is covered by the protective material, asensor functionality of the stress-sensitive sensor remains intact. Forexample, the protective material may be a silicone gel that has anelastic modulus and/or a Poisson's ratio that permits a force exertedthereon to be transferred to the MEMS pressure sensor. Thus, theprotective material is flexible enough that when the protective materialis depressed, the sensitive area of the MEMS pressure sensor is alsodepressed proportionally.

More particularly, the protective material permits full sensorfunctionality of the stress-sensitive sensor, including mechanicalfunctionality and electrical functionality, while sealing an entiresurface of the stress-sensitive sensor. Even more particularly, theprotective material is configured such that no functionality of thestress-sensitive sensor is impeded by the protective material.

By ensuring that the functionality of the stress-sensitive sensorremains intact, the protective material may be deposited onto thestress-sensitive sensor as a permanent material at an early stage of thechip fabrication process. Thus, the stress-sensitive sensor may alreadybe configured in an operable state (e.g., a final operable state) at thetime the protective material is deposited onto the stress-sensitivesensor, and the protective material may remain completely intact afterdeposition, including throughout the assembly process, such that itremains a feature in the final product.

As a result of the early deposition of the protective material, thestress-sensitive sensor is provided early particle and humidityprotection from foreign matter that may have been introduced during(pre-)assembly processes that could influence the sensor performance.

While some embodiments provided herein may refer to the protectivematerial as being a temperature hardening gel (e.g., silicone gel),others may use a ultraviolet (UV) hardening gel. However, the protectivematerial is not limited thereto, and may be any material that providesprotection from foreign matter while permitting sensor functionality ofthe stress-sensitive sensor, and more particularly permits sensorfunctionality of the stress-sensitive sensor at the time of depositionof the protective material. Thus, the protective material may be anyprotective gel.

FIG. 1A shows a vertical cross-sectional diagram of a chip 100 accordingto one or more embodiments. Specifically, FIG. 1A is a cross-sectiontaken along line A-A shown in FIGS. 1B and 1C. FIGS. 1B and 1Cillustrate a top-view and a bottom-view of the chip 100 shown in FIG.1A, respectively, according to one or more embodiments. FIG. 1D is avertical cross-sectional diagram of chip 100 taken along line B-B shownin FIGS. 1B and 1C.

The chip 100 includes a semiconductor substrate 10 (e.g., a siliconsubstrate) having a first main surface 11 at the frontside of the chip100 and a second main surface 12 21 at the backside of the chip 10,opposite to the frontside. The chip further includes a MEMS element 12integrated at the main surface 11.

In this example, the MEMS element 12 may be a capacitive MEMS element 12that includes two parallel conductive plates: a top electrode 13 and abottom electrode 14, separated by a dielectric material 15. For example,the dielectric material 15 may be a vacuum where a cavity is formedbetween the top electrode 13 and the bottom electrode 14. The vacuumserves as a reference pressure for the pressure sensor. A dielectriclayer (not illustrated) may also be disposed between the electrodes 13and 14 (e.g., on the upper surface of the bottom electrode 14).

The electrodes 13 and 14 form a capacitive element having a baseline orreference capacitance when no pressure is applied to the MEMS element12. The top electrode 13 is flexible and pressure sensitive, where asthe bottom electrode is rigid and fixed being located on the rigidsubstrate 10 beneath and/or around it. The top electrode 13 may be asensitive diaphragm or membrane and the cavity is formed between thefixed, bottom electrode 14 plate and the movable electrode 13 to allowdeflection of the diaphragm or membrane. When pressure is applied ontothe sensitive diaphragm, the cavity enclosed between the two parallelelectrodes 13 and 14 reduces in volume as the sensitive diaphragmdeflects and approaches the stationary one, resulting in a detectablechange in the capacitance between the electrodes 13 and 14 correspondingthe to applied pressure. The change in capacitance is a readable valuethrough an electrical signal.

Alternatively, the MEMS element 12 may be another type of integratedpressure sensor or another type of stress-sensitive sensor. Accordingly,each MEMS element 12 may occupy a MEMS area of the substrate 10 andincludes at least one sensitive area that is sensitive to and operableto detect stress. In general, a MEMS area may be referred to as a sensorarea or a stress-sensitive area of the substrate 10 at which astress-sensitive sensor is integrated at the substrate 10.

The chip 100 further includes a stress-decoupling feature made of one ormore stress-decoupling trenches 20. Each stress-decoupling trench 16 islaterally spaced from the MEMS element 12, extends from the main surface11 of the substrate 10 into the substrate 10, and extends partiallythrough the substrate 10. In other words, the trenches 20 do not extendcompletely through the substrate 10. The trenches 20 may be formed, forexample, by a frontside etching technique.

The trenches 20 define a vertical boundary between an inner or a firstregion 22 of the chip 100, where the MEMS element 12 is provided, andone or more peripheral or second regions 23 of the chip 100. Thetrenches 20 are configured to decouple any mechanical stress comingfrom, for example, the package of the chip 100 from being transferred tothe MEMS element 12. That is, the trenches 20 are configured to reduceany mechanical stress present in the peripheral region 22 of the chip100 from being transferred to the inner region 21 of the chip 100, andultimately to the MEMS element 12. Thus, the stress-decoupling featureshields the MEMS element 12 from external mechanical influences andthereby prevents a shift in a sensor signal produced by the MEMS element12, or a stress-sensitive sensor, due these influences.

In this example, trenches 20 may be a single, continuous trench 20 thatpartially or entirely surrounds the periphery of the first region 22 ofthe substrate 10 at which the MEMS element 12 is integrated. This firstregion 22 may also be referred to as a MEMS area or a stress-sensitivearea of the substrate 10. For example, a stress-sensitive area 10 b,shown in FIG. 1B, is defined by the surrounding trench 20. Astress-sensitive area.

Thus, whether the trench 20 is formed from one or more trenches, thetrench 20 surrounds at least a portion of the stress-sensitive area inorder to target stress-decoupling of this area.

The chip 100 further includes a plurality of particle filter trenches 27that are formed at the second main surface 21 (i.e, the backside) of thesubstrate 10. Thus, both stress-decoupling structures 20 and particlefilter trenches 27 are integrated into a single substrate (i.e., asingle semiconductor wafer). The particle filter trenches 27 protect thedecoupling trenches 20, as well as the stress-sensitive sensors 12, fromforeign particles. In particular, the particle filter trenches 27prevent particles from reaching (and blocking) stress decouplingtrenches. A width of the particle filter trenches and an angle at whichthey are arranged defines the allowed size of particles passingtherethrough. The particle filter trenches 27 also provide a backsidepressure coupling.

The particle filter trenches 27 are lateral trenches or cavities thatpartially extend laterally (i.e., having a longitudinal axis in thex-direction) along the second main surface 21. Each particle filtertrenches 27 is transverse to an intersecting portion of a respectivetrench 20. Specifically, in the cross-section shown in FIG. 1A, if thetrenches 20 are said to have a vertical extension along the y-axis, alongitudinal extension along the z-axis, and a transversal extension inthe x-axis, then a longitudinal extension of each particle filter trench27 extends orthogonal to the vertical extension of its respective trench20 and parallel to the transversal extension of its respective trench20. The longitudinal extension of each particle filter trench 27 mayalso extend orthogonal to the longitudinal extension of its respectivetrench, or at some other angle greater than zero degrees. That is, theeach particle filter trench 27 may be obliquely arranged such that itslongitudinal extension is at an angle between the x-axis and the z-axis,instead of being arranged solely along the x-axis or z-axis, as shown inFIG. 1B. The angle at which this longitudinal extension of the particlefilter trench helps to defines the allowed size of particles passingtherethrough.

The particle filter trenches 27 may be formed, for example, by abackside lithography and etching technique.

Each particle filter trench 27 intersects with an end portion of therespective trench 20 such that an opening from the frontside formed bythe trench 20 intersects with an opening from the backside formed by theparticle filter trench 27. From a top-view perspective, particle filtertrench 27 and its respective trench 20 form a cross-pattern or anX-pattern, depending on the angle of traversal. The intersecting portionof the particle filter trench 27 and its respective trench 20 is aportion at which the two openings conjoin, forming a pressure couplingopening 28 that extends entirely from the first main surface 11 to thesecond main surface 21. The pressure coupling opening 28 forms an openpathway that provides a backside pressure coupling.

In addition, a plurality of particle filter trenches 27 are provided,spaced apart from each other, along the longitudinal extension (i.e.,along the z-axis) of the respective trench 20. That is, multipleparticle filter trenches 27 are formed parallel to each other along thez-axis, spaced apart from each other by a portion of substrate thatextends fully to the second main surface 21. Thus, the substrate 10 is aone-piece integral member whose unitary construction is maintainedthroughout the entirety of the chip. In other words, two or moresubstrates are not used, nor is a single substrate broken into multipleparts by trenches or cavities.

Furthermore, it is noted that a underside 21 a of part of the substrate10 is exposed by the particle filter trenches 27. This feature is shownin FIGS. 1A and 1C. This underside portion 21 a represents an area wherea particle filter trench 27 is in contact with the substrate 10.

FIG. 2 shows a cross-sectional diagram of a chip 200 (e.g., a sensorchip) according to one or more embodiments. Similar to chip 100, thechip 200 includes a semiconductor substrate 10 (e.g., a siliconsubstrate) having a first main surface 11 at the frontside of the chip100 and a second main surface 21 at the backside of the chip 10,opposite to the frontside. The chip further includes a MEMS element 12integrated at the main surface 11.

The chip 200 further includes a stress-decoupling feature made of one ormore stress-decoupling trenches 20 a, 20 b, and 20 c, collectivelyreferred to as stress-decoupling trenches 20. Each stress-decouplingtrench 20 is laterally spaced from the MEMS element 12, extends from themain surface 11 of the substrate 10 into the substrate 10, and extendspartially through the substrate 10. In other words, the trenches 20 donot extend completely through the substrate 10. Thus, the trenches 20terminate in the silicon of a single wafer that includes the MEMSelement 12.

The trenches 20 define a vertical boundary between an inner or a firstregion 22 of the chip 100, where the MEMS element 12 is provided, andone or more peripheral or second regions 23 of the chip 200. Thetrenches 20 are configured to decouple any mechanical stress comingfrom, for example, the package of the chip 200 from being transferredthe MEMS element 12. That is, the trenches 20 are configured to reduceany mechanical stress present in the peripheral region 23 of the chip200 from being transferred to the inner region 22 of the chip 100, andultimately to the MEMS element 12. Thus, the stress-decoupling featureshields the MEMS element 12 from external mechanical influences andthereby prevents a shift in a sensor signal produced by the MEMS element12 or stress-sensitive sensor due these influences.

As noted above, each trench 20 extends partially, but not completelythrough the substrate 10. For example, the trenches 20 may have a depthof approximately 325-375 μm. In particular, the depth of the trenches 20is in the order of a distance between adjacent trenches that envelop theMEMS element 12 or deeper. As such, the formation of the trenches 20 inthe substrate 10 is exclusive to frontside trenching. A backside portion10 a is a portion of the substrate 10 that extends from the main surface21 at the backside of the chip 10 to the bottom of the deepest trench20.

As a result of the backside portion 10 a remaining intact as a singlemember, and like the substrate 10 in chip 100, the substrate 10 in chip200 is a one-piece integral member whose unitary construction ismaintained throughout the entirety of the chip. In other words, two ormore substrates are not used, nor is a single substrate broken intomultiple parts by trenches or cavities.

The stress-sensitive region 22 of the substrate 10 at which the MEMSelement 12 is arranged extends vertically from the main surface 11 andis integrally formed with the backside portion of the substrate 10.

One or more of the trenches may envelope the MEMS element 12. Forexample, trench 20 a may be a single, continuous trench that encirclesthe MEMS element 12. Similarly, trenches 20 b and 20 c, each adjacent totrench 20 a, may together form a single, continuous trench thatencircles the MEMS element 12.

Alternatively, trench 20 b may envelop a different MEMS element (notillustrated) that is laterally disposed from MEMS element 12 in adifferent MEMS area of the chip 200. Similarly, trench 20 c may envelopa further different MEMS element (not illustrated) that is laterallydisposed from MEMS element 12 in a further different MEMS area of thechip 200. Thus, the chip 200 may include one or more different MEMSareas, each of which includes a different MEMS element 12 integratedwith the substrate 10, where each MEMS element 12 includes one or moresensitive areas operable for detecting pressure and/or stress.

Additionally or alternatively, one or both trenches 20 b and 20 c mayextend from first lateral side of the substrate 10 to a second lateralside of the substrate 10 that is opposite to the first lateral side.

In addition, a spring structure 25 (e.g., spring structure 25 a or 25 b)is formed between two adjacent trench segments and is configured toabsorb external stress from the environment such that the amount of theexternal stress transferred to the inner region 22 (i.e., to the MEMSelement 12) is reduced or prevented. The external stress may be causedby the package itself (e.g., due to thermal mismatch). Two trenches ortrench segments that are adjacently arranged on a same lateral side ofthe MEMS element 12 so as to form a spring structure 25 therebetween maybe referred to as “adjacent” or “neighboring” trenches. Thus, a springstructure 25 is formed between a pair of adjacent trenches 20.

A spring structure 25 is defined as a portion of the substrate 10,arranged between two adjacent trenches 20 or between two laterallyseparated portions of a same trench 20, that extends from an upperportion of the backside portion 21 a towards the first main surface 11at the frontside of the chip 200. In other words, a spring structure 25forms the sidewalls of two adjacent trenches 20 or adjacent trenchsegments. In some embodiments, a spring structure 25 may extend to thefirst main surface 11 at the frontside of the chip 200. The two adjacenttrenches 20 or the two laterally spaced portions of a same trench 20extend parallel to each other such that the spring structure 25 isformed therebetween.

In this example, a spring structure 25 a is formed between trenches 20 aand 20 b and a spring structure 25 b is formed between trenches 20 a and20 c. Spring structures 25 a and 25 b may separate members or may be asingle member of unitary construction, for example, if trenches 20 b and20 c form a single trench that is concentric to trench 20 a.

Furthermore, each spring structure 25 may be electrically coupled to arespective MEMS element 12, and configured to receive a sensor signal(e.g., an electrical signal) generated by at least one sensitive area ofthe respective MEMS element 12 and provide an electrical path to asensor circuit that is configured to read out the sensor signal.

All spring structures 25 of the chip are conjoined by a backside portionof the substrate 10, which is of a one-piece integral construction.

The chip 200 further includes a plurality of particle filter trenches 27(e.g., particle filter trenches 27 a and 27 b) that are formed at thesecond main surface 21 (i.e., the backside) of the substrate 10 suchthat they are integrally formed with the backside portion 10 a. Theparticle filter trenches 27 are arranged similarly to those described inreference to FIGS. 1A-1C, with the exception that the longitudinalextension of each particle filter trench 27 may span two or moretrenches 20. For example, particle filter trenches 27 a transverselyspans across trenches 20 a and 20 b, while particle filter trenches 27 btransversely spans across trenches 20 a and 20 c.

Specifically, each particle filter trench 27 intersects with an end(i.e., bottom) portion of one or more respective trenches 20 orrespective trench segments of a trench 20 such that openings from thefrontside formed by the trench 20 intersects with an openings from thebackside formed by the particle filter trench 27. From a top-viewperspective, each particle filter trench 27 and its respective trench 20form a cross-pattern or an X-pattern, depending on the angle oftraversal. The intersecting portion of the particle filter trench 27 andits respective trench 20 is a portion at which the two openings conjoin,forming a pressure coupling opening 28 that extends entirely from thefirst main surface 11 to the second main surface 21. The pressurecoupling opening 28 forms a pathway that provides a backside pressurecoupling.

In addition, a plurality of particle filter trenches 27 are provided,spaced apart from each other, along the longitudinal extension (i.e.,along the z-axis) of the respective trench 20. That is, multipleparticle filter trenches 27 are formed parallel to each other along thez-axis, spaced apart from each other by a portion of substrate thatextends fully to the second main surface 21. Thus, the substrate 10 is aone-piece integral member whose unitary construction is maintainedthroughout the entirety of the chip. In other words, two or moresubstrates are not used, nor is a single substrate broken into multipleparts by trenches or cavities.

Furthermore, it is noted that a underside 21 a of part of the substrate10 is exposed by the particle filter trenches 27. This underside portion21 a represents an area where a particle filter trench 27 is in contactwith the substrate 10.

FIG. 3A shows a top-view diagram of a chip 300 according to one or moreembodiments. Shading has been provided to indicate a first main surface11 of the substrate and is used merely to assist in distinguishing thefirst main surface 11 from trenches 20. Additionally, FIG. 3B shows across-sectional diagram of chip 300 taken along line C-C shown in FIG.3A. In particular, the substrate 10 includes four MEMS areas 10 b, 10 c,10 d, and 10 e at which different MEMS elements area integrated at thefirst main surface 11. In this example, each MEMS element includes foursensitive areas laterally separated from each other and arranged in agrid formation. Each sensitive area is configured to generate anelectrical signal in response to a detected pressure and/or stress. Theelectrical signals generated by the sensitive areas of a MEMS elementmay be added or averaged together by the sensor circuit.

As can bee seen in FIG. 3A, MEMS area 10 b includes a MEMS element thatincludes sensitive areas 12 b, MEMS area 10 c includes a MEMS elementthat includes sensitive areas 12 c, MEMS area 10 d includes a MEMSelement that includes sensitive areas 12 d, and MEMS area 10 e includesa MEMS element that includes sensitive areas 12 e. Each MEMS area mayhave a rectangular shape.

In addition, a plurality of trenches 20 are formed between adjacent orneighboring MEMS areas 10 b-10 e. Moreover, a trench 20 or a segment ofa trench 20 is also formed around a peripheral region of the MEMS areas10 b-10 e, between the MEMS area and the lateral edges of the chip 300.Furthermore, one or more trenches 20 may be conjoined to form a single,continuous trench.

Spring structures 25 (e.g., spring structures 25 a and 25 b) are formedbetween two adjacent trenches 20 or between two laterally separatedportions of a same trench 20.

The plurality of trenches 20 includes trench 20 b that encircles MEMSarea 10 b. In particular, trench 20 b includes a first end B and asecond end B′. Thus, in this example, trench 20 b wraps around the MEMSarea 10 b 1.5 times such that one trench segment is formed by trench 20b at the outer peripheral edges (i.e., those edges neighboring an edgeof the chip 300) of the MEMS area and two trench segments are formed bytrench 20 b at the inner peripheral edges (i.e., those edges notneighboring an edge of the chip 300, or rather those edges that are mostproximate to adjacent MEMS areas 10 c and 10 d).

As a result, a pair of adjacent stress-decoupling trenches or trenchsegments are formed from one lateral side of the MEMS area 10 b by asingle, continuous trench 20 b that encircles the MEMS area 10 b suchthat at least a portion of the single, continuous trench overlaps withitself in a lateral direction. Such an arrangement may occur when thesingle, continuous trench 20 b has a spiral pattern that winds aroundthe MEMS area 10 b, with a spring structure 25 formed between laterallyoverlapping segments of the trench 20 b. It naturally follows that thespring structure 25 may also have a spiral pattern that is congruentwith the spiral pattern of the single, continuous trench 20 b.

Similar to trench 20 b, trench 20 c includes a first end C and a secondend C′. Thus, in this example, trench 20 c wraps around the MEMS area 10c 1.5 times such that one trench segment is formed by trench 20 c at theouter peripheral edges (i.e., those edges neighboring an edge of thechip 300) of the MEMS area and two trench segments are formed by trench20 c at the inner peripheral edges (i.e., those edges not neighboring anedge of the chip 300, or rather those edges that are most proximate toadjacent MEMS areas 10 b and 10 e).

Similar to trench 20 b, trench 20 d includes a first end D and a secondend D′. Thus, in this example, trench 20 d wraps around the MEMS area 10d 1.5 times such that one trench segment is formed by trench 20 d at theouter peripheral edges (i.e., those edges neighboring an edge of thechip 300) of the MEMS area and two trench segments are formed by trench20 d at the inner peripheral edges (i.e., those edges not neighboring anedge of the chip 300, or rather those edges that are most proximate toadjacent MEMS areas 10 b and 10 e).

Similar to trench 20 b, trench 20 e includes a first end E and a secondend E′. Thus, in this example, trench 20 e wraps around the MEMS area 10e 1.5 times such that one trench segment is formed by trench 20 e at theouter peripheral edges (i.e., those edges neighboring an edge of thechip 300) of the MEMS area and two trench segments are formed by trench20 e at the inner peripheral edges (i.e., those edges not neighboring anedge of the chip 300, or rather those edges that are most proximate toadjacent MEMS areas 10 c and 10 d).

Trench 20 f includes a first end F and a second end F′ such that thetrench 20 f extends laterally from one edge of the chip 300 to a secondedge of the chip 300 that is opposite to the first edge of the chip.Trench 20 f may also be formed to unite with trenches 20 b-20 d, forminga single, continuous trench.

As such, five trenches 20 are formed laterally between MEMS areas 10 band 10 c, with four spring structures 25 formed laterally therebetween.In this case, there are five pairs of adjacent trenches arrangedlaterally between MEMS areas 10 b and 10 c, which results in the fourspring structures 25 (i.e., each pair has a corresponding springstructure 25 arranged therebetween).

In addition, five trenches 20 are formed laterally between MEMS areas 10d and 10 e, with four spring structures 25 formed laterallytherebetween; four trenches 20 are formed laterally between MEMS areas10 b and 10 d, with three spring structures 25 formed laterallytherebetween; and four trenches 20 are formed laterally between MEMSareas 10 c and 10 e, with three spring structures 25 formed laterallytherebetween. The spring structures 25 are configured to absorb externalstress from the environment such that each MEMS area 10 b-10 e, and thuseach sensitive area of the MEMS elements, is insulated from the externalstress.

The chip 300 further includes a plurality of particle filter trenches 27that are formed at the second main surface 21 (i.e, the backside) of thesubstrate 10 such that they are integrally formed with the backsideportion 10 a. The particle filter trenches 27 are arranged similarly tothose described in reference to FIGS. 1A-1C, with the exception that thelongitudinal extension of each particle filter trench 27 may span one ormore trenches 20.

Specifically, each particle filter trench 27 intersects with an endportion of one or more respective trenches 20 such that openings fromthe frontside formed by the trench 20 intersects with an openings fromthe backside formed by the particle filter trench 27. As can be seen,multiple particle filter trenches 27 may also extend between MEMS areas10 b-10 e, transversely spanning the trenches 20 formed therebetween.

From a top-view perspective, each particle filter trench 27 and itsrespective trench 20 form a cross-pattern or an X-pattern, depending onthe angle of traversal. The intersecting portion of the particle filtertrench 27 and its respective trench 20 is a portion at which the twoopenings conjoin, forming a pressure coupling opening 28 that extendsentirely from the first main surface 11 to the second main surface 21.The pressure coupling opening 28 forms a pathway that provides abackside pressure coupling.

FIGS. 4A-4D illustrate cross-sectional views of a manufacturing processof integrated stress-sensitive sensors according to one or moreembodiments. In particular, FIG. 4A illustrates a frontend fabricationstep that includes integrating a plurality of stress-sensitive sensors12 in a substrate 10 (i.e., a semiconductor wafer), formingstress-decoupling trenches 20, and forming contact pads 40. Thestress-sensitive sensors 12 may be MEMS pressure sensors or some otherstress-sensitive sensor, as described above.

The contacts pads 40 are laterally spaced on the first main surface 11from the trenches 20, and further laterally spaced from a respectivestress-sensitive sensor 12 to which the contact pad is electricallyconnected.

In addition, an optional protective material 41 may be disposed overeach stress-sensitive sensors 12. The protective material 41 may be usedfor particle protection.

Next, FIG. 4B illustrates a lid attachment step during which aprotective cap 42 is disposed over a respective stress-sensitive sensor12. The protective cap 42 may include a frame that is bonded to thefirst main surface 11 of the substrate 10 and a lid that extends overand encapsulates the respective stress-sensitive sensor 12. The frame ofthe protective cap 42 may be bonded to the substrate 10 in an areabetween a stress-decoupling trench 20 and a contact pad 40. Theprotective cap 42 may be made of SU8 and/or glass. For example, theframe portion may be made of SU8 and the lid portion may be made of SU8or glass.

Next, FIG. 4C illustrates a grinding or a wafer thinning process isapplied to the backside of the substrate 10 to reduce the chip height(i.e., to reduce the thickness of the substrate). The thinning of thesubstrate 10 is limited such that the stress decoupling trenches 20remain at a vertical distance from the second main surface 21 (i.e., thebackside) of the substrate.

Next, FIG. 4D illustrates a backside lithography and silicon etchprocess for particle filter trench formation. In other words, it is herewhere the particle filter trenches 27 are formed. The particle filtertrenches 27 protect the decoupling trenches 20, as well as thestress-sensitive sensors 12, from foreign particles. The particle filtertrenches 27 also provide a backside pressure coupling.

Following, the particle filter trench formation, individual sensor chipsmay be formed by dicing (not illustrated).

FIGS. 5A-5G illustrate cross-sectional views of a manufacturing processof integrated stress-sensitive sensors according to one or moreembodiments that includes wafer level ball (WLB) grid array integration.In particular, FIG. 5A illustrates a frontend fabrication step thatincludes integrating a plurality of stress-sensitive sensors 12 in asubstrate 10 (i.e., a semiconductor wafer), forming stress-decouplingtrenches 20, and forming contact pads 40. The stress-sensitive sensors12 may be MEMS pressure sensors or some other stress-sensitive sensor,as described above.

The contacts pads 40 are laterally spaced on the first main surface 11from the trenches 20, and further laterally spaced from a respectivestress-sensitive sensor 12 to which the contact pad is electricallyconnected.

In addition, an optional protective material 41 may be disposed overeach stress-sensitive sensors 12. The protective material 41 may be usedfor particle protection.

Next, FIG. 5B illustrates a lid attachment step during which aprotective cap 52 is disposed over all the stress-sensitive sensors 12and attached to the main surface 11 of the substrate 10. The protectivecap 52 may be a pre-structured interposer, and, more specifically, apre-structured glass or silicon wafer. If glass, a UV glue may be usedas an adhesive for attaching the structure to the substrate.

The protective cap 52 may include cavities or trenches 53 (e.g.,trenches 53 a and 53) that are disposed over different portions of thefirst main surface 11. For example, a trench 53 a may extend over eachcontact pad 40. Additionally, a trench 53 b may be provided in an areabetween sensor chips or sensor areas.

Next, FIG. 5C illustrates a grinding applied to the top-side of theprotective cap 52 to expose the trenches 53 to form through holes 54 aand 54 b that extend through the protective cap.

Next, FIG. 5D illustrates a through silicon via (TSV) process duringwhich an electrically conductive fill material 55 is disposed in throughholes 54 a to form a via in order to make an electrical connection withthe contact pads 40.

Next, FIG. 5E illustrates a grinding or a wafer thinning process isapplied to the backside of the substrate 10 to reduce the chip height(i.e., to reduce the thickness of the substrate). The thinning of thesubstrate 10 is limited such that the stress decoupling trenches 20remain at a vertical distance separated from the second main surface 21(i.e., the backside) of the substrate.

Next, FIG. 5F illustrates a backside lithography and silicon etchprocess for particle filter trench formation. In other words, it is herewhere the particle filter trenches 27 are formed. The particle filtertrenches 27 protect the decoupling trenches 20, as well as thestress-sensitive sensors 12, from foreign particles. The particle filtertrenches 27 also provide a backside pressure coupling.

Next, FIG. 5G illustrates applying electrically conductive interconnectstructures 56 (e.g., solder balls) on top of the fill material 55 (i.e.,vias) such that the interconnect structures 56 are respectivelyconnected to the contact pads 40. In addition, a redistribution layer(RDL) may also be formed prior to forming the interconnect structures56.

FIGS. 6A and 6B illustrate cross-sectional views of an alternativemanufacturing process of integrated stress-sensitive sensors accordingto one or more embodiments that includes wafer level ball (WLB) gridarray integration.

In order to limit the temperature budget for the protective material 41one could also prepare the semiconductor wafer 10 and the glassinterposer 62 separately, and then attach the two wafers together with ashort heat up for gluing or via a UV light sensitive glue without anadditional high temperature step. A redistribution layer 65 might beintroduced and integrated with the glass interposer 62 to efficientlyuse the chip size and/or to contact the pads 40 and interconnectstructures 56.

In particular, the glass interposer 62 may include vias 55 andredistribution layers 65 formed prior to attaching the semiconductorwafer 10 and the glass interposer 62 together. Similarly, semiconductorwafer 10 may include the frontend components as well as the particlefilter trenches 27 integrated therewith prior to attaching thesemiconductor wafer 10 and the glass interposer 62 together. Afterattaching the semiconductor wafer 10 and the glass interposer 62together, the interconnect structures 56 may be provided on the vias 55and/or redistribution layer 65.

Although embodiments described herein relate to MEMS pressure sensors,and, in some cases capacitive pressure sensors, it is to be understoodthat other implementations may include other types of stress-sensitivesensors or other types of MEMS devices or MEMS elements. In addition,although some aspects have been described in the context of anapparatus, it is clear that these aspects also represent a descriptionof the corresponding method, where a block or device corresponds to amethod step or a feature of a method step. Analogously, aspectsdescribed in the context of a method step also represent a descriptionof a corresponding block or item or feature of a correspondingapparatus. Some or all of the method steps may be executed by (or using)a hardware apparatus, like for example, a microprocessor, a programmablecomputer or an electronic circuit. In some embodiments, some one or moreof the method steps may be executed by such an apparatus.

Further, it is to be understood that the disclosure of multiple acts orfunctions disclosed in the specification or claims may not be construedas to be within the specific order. Therefore, the disclosure ofmultiple acts or functions will not limit these to a particular orderunless such acts or functions are not interchangeable for technicalreasons. Furthermore, in some embodiments a single act may include ormay be broken into multiple sub acts. Such sub acts may be included andpart of the disclosure of this single act unless explicitly excluded.

Furthermore, the description and drawings merely illustrate theprinciples of the disclosure. It will thus be appreciated that thoseskilled in the art will be able to devise various arrangements that,although not explicitly described or shown herein, embody the principlesof the disclosure and are included within its spirit and scope.Furthermore, all examples recited herein are principally intendedexpressly to be only for pedagogical purposes to aid in theunderstanding of the principles of the disclosure and the conceptscontributed to furthering the art, and are to be construed as beingwithout limitation to such specifically recited examples and conditions.Moreover, all statements herein reciting principles, aspects, andembodiments of the disclosure, as well as specific examples thereof, areintended to encompass equivalents thereof. Thus, it is understood thatmodifications and variations of the arrangements and the detailsdescribed herein will be apparent to others skilled in the art.

Furthermore, the following claims are hereby incorporated into thedetailed description, where each claim may stand on its own as aseparate example embodiment. While each claim may stand on its own as aseparate example embodiment, it is to be noted that—although a dependentclaim may refer in the claims to a specific combination with one or moreother claims—other example embodiments may also include a combination ofthe dependent claim with the subject matter of each other dependent orindependent claim. Such combinations are proposed herein unless it isstated that a specific combination is not intended. Furthermore, it isintended to include also features of a claim to any other independentclaim even if this claim is not directly made dependent to theindependent claim.

What is claimed is:
 1. A method of manufacturing a semiconductor device,the method comprising: performing a frontend fabrication of asemiconductor substrate having a first surface and a second surfacearranged opposite to the first surface, the frontend fabricationincluding integrating a first stress-sensitive sensor disposed at thefirst surface of the semiconductor substrate, and forming a firststress-decoupling trench in the semiconductor substrate, wherein thefirst stress-decoupling trench has a vertical extension that extendsfrom the first surface into the semiconductor substrate, wherein thefirst stress-decoupling trench vertically extends partially into thesemiconductor substrate towards the second surface although notcompletely to the second surface; and forming a plurality of particlefilter trenches at the second surface of the semiconductor substrate,wherein the plurality of particle filter trenches vertically extend fromthe second surface into the semiconductor substrate, wherein each of theplurality of particle filter trenches have a longitudinal extension thatextends orthogonal to the vertical extension of the firststress-decoupling trench, and wherein each of the plurality of particlefilter trenches is separated from an adjacent particle filter trench ofthe plurality of particle filter trenches by a backside portion of thesemiconductor substrate that extends from the second surface to a bottomof the first stress-decoupling trench, and wherein the each of theplurality of particle filter trenches forms a cross-pattern or anX-pattern with the first stress-decoupling trench.
 2. The method ofclaim 1, further comprising: attaching a cap to the first surface,wherein the cap encapsulates the first stress-sensitive sensor and thefirst stress-decoupling trench.
 3. The method of claim 2, wherein thefrontend fabrication includes forming contact pads on the first surface,and the cap, the first stress-sensitive sensor, and the firststress-decoupling trench are disposed between the contact pads.
 4. Themethod of claim 3, wherein the cap is an interposer that includesconductive vias aligned with the contact pads.
 5. The method of claim 1,wherein the first stress-decoupling trench includes the verticalextension along a first axis, a longitudinal extension along a secondaxis orthogonal to the first axis, and a transversal extension along athird axis orthogonal to the first axis and the second axis, and thelongitudinal extension of the plurality of particle filter trenches isarranged at an angle that is parallel to the third axis or at an anglethat is between the second axis and the third axis.
 6. The method ofclaim 5, wherein the plurality of particle filter trenches are separatedfrom each other along the second axis.
 7. The method of claim 1, whereineach of the plurality of particle filter trenches intersects with thebottom of the first stress-decoupling trench such that the plurality ofparticle filter trenches conjoin with the first stress-decoupling trenchto form a plurality of openings that extend from the first surface tothe second surface.
 8. The method of claim 1, further comprising:forming a second stress-decoupling trench adjacent to the firststress-decoupling trench, the second stress-decoupling trench having avertical extension that extends from the first surface into thesemiconductor substrate, wherein the second stress-decoupling trenchvertically extends partially into the semiconductor substrate towardsthe second surface although not completely to the second surface,wherein the longitudinal extension of each of the plurality of particlefilter trenches transversely spans across the first stress-decouplingtrench and the second stress-decoupling trench.
 9. The method of claim8, wherein the each of the plurality of particle filter trenchesintersects with the second stress-decoupling trench in a cross patternor an X-pattern.